Test sockets are consumable components used to verify the electrical performance and reliability of individual chips after the wafer process, and demand for them tends to rise alongside growing demand for HBM, DDR5, and other memory as well as AI- and automotive-related non-memory semiconductors.
Demand for IC test sockets used in semiconductor and electronic component inspection arises necessarily during the development and mass production of both memory chips such as DDR5 and HBM and non-memory chips for AI, 5G, and automotive system semiconductors.
Competition among technology formats, however, is intensifying.
Sockets are divided into pin-type, which uses precision metal pins for superior heat and wear resistance, and rubber-type, which uses silicone and suits finer processes; ISC has entered the market with rubber-type module sockets in a segment where Okins Electronics and Micro Contact Solution had historically supplied pin-type sockets.
A new technical challenger has also emerged at the finer end of the market.
Orum Materials said it developed, for the first time in the industry, an ultra-fine test socket using a 3D MEMS-based horizontal cantilever design capable of directly testing HBM micro-bumps—roughly 16,000 bumps at a 65-micrometer pitch—an area physically inaccessible to conventional pogo-pin (300 micrometers or larger) or rubber-pin (250 micrometers or larger) sockets.
The company stated it plans to enter the HBM and LPDDR test-socket market by next year before expanding into logic-chip testing for GPUs and CPUs and into the probe-card market.
This illustrates how the technological boundaries of the pin-type socket market, where Micro Contact Solution holds strength, could be reshaped as HBM designs become finer.
On the demand side, the pace at which Samsung Electronics and SK hynix expand HBM production capacity remains an important variable for test-socket demand.