Duksan Hi-Metal specializes in manufacturing joining materials used in semiconductor packaging, with core products including Solder Ball (SB), Micro Solder Ball (MSB), Core Solder Ball (CSB), and solder paste.
Solder balls are used in DRAM and NAND packaging, micro solder balls in FC-BGA and HDD interconnects, and core solder balls in mobile AP packaging.
Key customers include domestic memory IDMs and OSAT firms, along with substrate makers such as Samsung Electro-Mechanics and Unimicron, and in the high-performance micro solder ball segment the company forms a duopoly structure with Japan's Senju Metal.
Consolidated subsidiaries include Duksan Ethercity, a high-pressure gas vessel maker supplying semiconductor specialty gas and hydrogen gas containers, and Duksan Nepcore, a navigation and anti-jamming solutions provider for defense and aerospace acquired in 2021.
Duksan Nepcore produces satellite navigation devices, anti-jamming systems, and integrated navigation devices, and has partnered with major domestic defense firms such as Hanwha Aerospace, LIG Nex1, and Hyundai Rotem.
Separately, Duksan Neolux, an OLED materials maker spun off from the company in 2015, is now classified as an equity-method affiliate and is not part of the consolidated results.
In this way, the company is diversifying its portfolio beyond its core semiconductor joining materials business into defense and specialty gas areas.