The upstream memory semiconductor market is in a phase where DRAM shipments are rising and NAND process layers are increasing simultaneously, driven by AI server and data center demand.
Industry estimates put the photoresist market growing from about USD1.4bn in 2024 to about USD2.4bn by 2030, with the EUV materials segment expanding from roughly USD170mn in 2022 to about USD1.1bn by 2030.
A Daishin Securities report noted that Samsung Electronics has been carrying out V8/V9 NAND conversion investment at its Xi'an, China plant since the second half of 2025, with the number of KrF PR-applied layers rising from 5-6 in V6/V7 to 7 in V8 and 10 in V9.
This is cited as a structural factor that increases KrF material usage as long as the generational transition continues.
In the competitive landscape, Japan's Maruzen and Toyo Gosei lead in raw materials (polymer/PAG), while TOK, JSR, and Fujifilm dominate finished PR products, positioning Samyang NC Chem as a beneficiary of supply-chain diversification given its domestic localization capability.
Some analyses point to rising Chinese demand to reduce reliance on Japanese materials amid Sino-Japanese tensions, cited as a backdrop for interest in Samyang NC Chem as an alternative KrF raw-material supplier in China's legacy-process-heavy market, though this remains at an early stage with actual revenue contribution yet to be confirmed.
In next-generation packaging, industry observers expect the glass substrate market to enter a full growth phase after 2030, with domestic players such as Samsung Electro-Mechanics and SKC's Absolics competing to establish commercialization timelines, placing Samyang NC Chem's glass-substrate PR material development within this broader value-chain competition.