The confirmed facts center on the size of investment and its timeline. On May 11, 2026 the company approved KRW 213.0 billion of new facility investment to expand a semiconductor product plant, with the investment period running to December 31, 2027.
Then on July 20, 2026 it disclosed KRW 497.0 billion of investment in semiconductor production equipment and ancillary facilities, again through December 31, 2027, equal to 55.39% of shareholders' equity.
Including KRW 52.8 billion for the acquisition of Newflex's Ansan plant and KRW 90.0 billion of previously deferred FC-BGA investment, the investment identified this year totals about KRW 850 billion, exceeding the KRW 540.0 billion of cumulative FC-BGA investment disclosed in 2020-2022.
Start-up timing has also been indicated. The target for equipment operation is the second quarter of 2027 for FC-BGA and the third quarter of 2027 for FC-CSP, with FC-BGA expected to start earlier because equipment is being installed in existing infrastructure, whereas FC-CSP is tied to completion of a new building.
On the demand side, the company said on July 22, 2026 that talks with multiple global big-tech customers over long-term supply agreements for FC-BGA, FC-CSP and memory substrates were largely in the final stage, and that it was selectively reviewing volumes it can serve amid customer requests for LTA- and prepayment-based expansion.
On products, Meritz Securities stated in a June 2026 report that Daeduck had begun mass production of large-body FC-BGA and that mass production of large-area, high-layer FC-BGA for AI networking would ramp from the second half.
On utilization, Yuanta Securities in a July 2026 report identified FC-BGA as the key second-half variable.
On funding, the company plans to cover investment from cash on hand and EBITDA, with first-quarter 2026 cash and equivalents of KRW 215.7 billion including KRW 140.1 billion of short-term financial instruments, against total borrowings of KRW 9.5 billion.