GIS Co., Ltd. is a comprehensive equipment manufacturer whose core equipment division makes cutting tools for semiconductors, displays, and multilayer ceramic capacitors (MLCCs), alongside automation (FA System), drone, and new businesses such as robotics and food-tech.
The equipment division supplies Dicing Saw, Singulator, Saw & Sorter, and MLCC Cutter tools, and since its earlier days as Neontech has supplied wafer dicing machines to large domestic customers including Samsung Electro-Mechanics, Samsung LED, and LG Innotek, as well as numerous overseas clients.
In 2016 the company established a drone division applying its semiconductor control and cutting technologies, and has continued developing military and logistics unmanned aircraft as well as vertical take-off and landing (VTOL) systems.
In January 2026, the company absorbed its wholly owned subsidiary, the former 'GIS' (a display manufacturing equipment maker), changed its name from Neontech to GIS Co., Ltd., and unified its business identity around semiconductor and display process automation equipment.
The merger introduced a co-CEO structure led by professional managers, and the company expected total assets to expand to roughly KRW 140 billion.
Building on its automation technology, the company is also pursuing F&B robotics equipment and AI system businesses, and has completed development of an automatic fryer called 'Boglebot' to enter the food-tech market.
The cutting-equipment market for semiconductors and displays is understood to be an oligopoly dominated by a small number of domestic and overseas players, and the company operates on the basis of long-standing relationships with its major customers.
As is typical for equipment makers, results are heavily influenced by the capital expenditure cycles of customers, with the timing and scale of customer investment directly affecting revenue recognition.