Innox Advanced Materials operates across four segments built on polymer synthesis and compounding technology: OLED display materials (INNOLED), semiconductor packaging materials (INNOSEM), flexible printed circuit board (FPCB) circuit materials, and the newer battery/lithium materials business (INNOBM, via subsidiary Innox Lithium).
Domestic FPCB materials made by Innox and other Korean makers have displaced Japanese products to control more than 90% of the local market, while in semiconductor packaging materials the company is positioned as the only domestic partner with a full product line-up.
Its OLED materials supply core components to most global OLED panel makers, serving roughly 200 customers across mobile display and semiconductor applications domestically and abroad.
The INNOSEM semiconductor materials unit supplies Die Attach Film (DAF) and Quad Flat No-lead (QFN) materials mainly to domestic IDM companies and Taiwanese foundries, and is jointly developing Build-up Film to replace Japanese-monopolized ABF film, along with low-dielectric CCL materials, with domestic customers.
In new business areas, the company exclusively supplies EMI shielding carrier tape to the world's largest space company and is pursuing expansion into defense, robotics, and AI semiconductor packaging applications built on that track record.
Subsidiary Innox Lithium has secured processing technology to convert low-purity lithium carbonate into high-purity lithium hydroxide, successfully shipping its first sample to a domestic customer in February 2026 ahead of planned mass-production deliveries in the second half of the year.
Its Asan plant holds the world's largest production capacity in semiconductor packaging and FPCB materials, complemented by overseas sites in Guangzhou, China and Bac Ninh, Vietnam, forming a global supply chain.
Competitively, domestic peer Duksan Neolux is a key rival in OLED materials, while one or two Japan-based firms remain the principal competitors in core semiconductor packaging technology.