The company has positioned its sensor business as a future growth pillar and is developing a range of products including MEMS microphones, ultrasonic sensors, and short-wavelength infrared (SWIR) sensors.
Its MEMS microphone sensor, based on an ultra-compact, low-power design targeting an SNR of 65-67 dBA, is being developed with customer-specific design libraries and is targeted for mass production in 2026, while the ultrasonic sensor has entered prototype production aimed at securing 6-inch and 8-inch process capability.
According to industry sources, MEMS sensors and some other products are planned to enter initial mass production starting in the second half of 2026, a period during which more substantial revenue contribution is expected.
In automotive and power semiconductors, the company is deepening cooperation with US-based Elevation Microsystems, which received strategic investment from Hyundai Mobis, to expand into robotics and automotive sensor applications, while working with France's Cortus to provide a RISC-V-based SoC development platform to automotive customers.
It is also developing readout integrated circuits (ROIC) that convert sensor signals into electrical signals, aiming to build an integrated solution spanning design, process development and packaging.
As a member of the Korea-US AI Semiconductor Innovation Center established in Silicon Valley, the company has secured a local sales foothold and plans to expand its US customer base through Stratio and Elevation Microsystems.
That said, the mass-production timeline and revenue contribution of these new businesses remain at an early stage, making it important to monitor when actual production ramp-up and customer adoption begin to show up in results.