The back-end semiconductor test equipment market is experiencing a wave of orders driven by expanded HBM4 and enterprise SSD (eSSD) capacity investment from Samsung Electronics and SK Hynix.
Hanwha Investment & Securities noted that large-scale orders toward memory test equipment makers have been increasing recently, with Samsung Electronics beginning to place large test equipment orders and orders for a new type of tester, the Chambered Low-frequency Tester (CLT), also starting.
Samsung Electronics is reportedly setting up a fab focused on HBM back-end processes in Onyang, while relocating existing general-purpose DRAM and NAND test equipment from Onyang to a newly built plant in Vietnam, increasing tester orders in both locations.
SK Hynix is also expanding HBM4 wafer tester investment, with its advanced packaging-dedicated fab (P&T7) in Cheongju, requiring about KRW 19 trillion in total investment, targeting completion of the wafer test line in October 2027 and the wafer-level package line in February 2028.
At CES 2026, Nvidia's CEO pointed to memory bottlenecks in GPU support processes while mentioning the potential for SSD commercialization, a factor cited as supporting expectations for greater SSD tester demand.
In terms of competitive positioning, Exicon is classified as a memory package tester specialist, facing new competition from Neosem in the CLT segment after its entry at Samsung, while Teradyne is cited as a competitor in SSD testers.
Upcycle periods tend to lift revenue broadly across equipment makers, as illustrated by the case where DI reported second-quarter revenue of KRW 168.6 billion, up 41.4% year-on-year, with operating profit of KRW 39.6 billion, up 223.2% year-on-year and 109.8% quarter-on-quarter.