Founded in 2002, Techwing makes back-end semiconductor test equipment; its core products are probe stations, Cube Prober, and memory and system-on-chip test handlers, while key customers include SK hynix, Micron, Kioxia, Intel and Infineon.
Memory test handlers transport and sort chips and create the thermal environment during testing, and the company was first in the world to commercialize a handler testing 768 chips simultaneously, with its memory-segment share cited at around 70%.
It does not sell test handlers to Samsung Electronics, whose handlers are supplied by affiliate Semes. Cube Prober, the new growth axis, dices wafers into individual dies and rearranges them in cube form so each die can be tested individually, cutting cost and time versus the older, more complex flow.
As HBM stacks move from 8 and 12 layers toward 16, yield becomes harder to secure, structurally raising the importance of test steps.
On customer traction, the company won its first Cube Prober mass-production order from Samsung Electronics in January 2025, followed by a second order that March, and Samsung has since been using Cube Prober in HBM4 mass production, SK hynix completed its quality evaluation, and demo units were reported to have gone to Micron.
Disclosed contracts followed: a KRW 22.9bn test equipment supply deal with Micron Memory Malaysia in April 2026, with deliveries starting 20 June 2026 and final delivery slated for 1 August, and a KRW 9.7bn HBM test equipment contract with Samsung Electronics in May 2026 covering 18 May to 13 August 2026.
Management stated that handler demand is also rising on domestic and overseas capacity additions, so legacy and new businesses are growing together, and that a non-memory probe station has passed a domestic customer's quality evaluation while the memory version is nearing completion.
The portfolio is thus a two-track structure of handlers plus Cube Prober and probe stations; segment revenue splits are not formally disclosed, limiting quantitative comparison.