As the AI era has opened and the global semiconductor market has entered a supercycle boom, Samsung Electronics, SK hynix, and Micron of the United States have all embarked on large-scale factory expansion investments.
In particular, reflecting the surge in demand for high-bandwidth memory (HBM) essential for data centers, back-end equipment makers for inspection, sorting, and handling have shown relatively greater benefits. Rorze Systems is also seeing its semiconductor-segment order backlog grow amid this trend.
The display segment, after a period of relatively muted domestic and overseas investment, has entered a phase of renewed back-end investment triggered by a new foldable model launch from a North American smartphone maker.
However, the glass-substrate laser-cutting equipment market that the company has been preparing as a new growth driver is seeing its commercialization timeline pushed back further than initially expected.
Samsung Electro-Mechanics announced the establishment of a joint venture called GlaSSEM with Dongwoo Fine-Chem, a subsidiary of Japan's Sumitomo Chemical Group, to produce glass core, the key material for glass substrates, with total investment of about KRW 480 billion, and the headquarters and production site to be located within Dongwoo Fine-Chem's Pyeongtaek plant.
However, Samsung Electro-Mechanics' glass-substrate investment schedule has been delayed due to bottlenecks in customer prototype reliability evaluation, which has in turn pushed back the production line construction schedule for the glass-core joint venture GlaSSEM and left the timing of related equipment orders uncertain.
This is a variable that could also affect when Rorze Systems' laser glass-cutting technology generates new revenue.