Founded in 1998, TechL is a memory semiconductor back-end packaging specialist whose core business is Storage SIP (System in Package), producing memory cards, eMMC, SSD, and eMCP.
The company began its flash memory card business by supplying SmartMedia Cards to Samsung Electronics in its early years and now manufactures the full range of memory card products, supplying customers domestically as well as in the United States, Japan, other parts of Asia, Europe, and China.
Production is split between the headquarters in Hwaseong, Gyeonggi Province, and a Vietnam facility; as of the first quarter of 2026, annual capacity at headquarters was about 219.75 million units on a wire-bonding basis, while the Vietnam site had capacity of roughly 20.79 million units per year.
In the same quarter, headquarters production output was 5.757 million units, and total raw material purchases came to KRW 2.846 billion, of which PCB purchases accounted for KRW 1.58 billion, or 55.51% of the total, alongside NAND flash memory chips and controllers as key input materials.
The company changed its name from Barun Electronics to TechL in November 2022, and following several rounds of rights offerings and convertible bond issuance and conversion, the largest shareholder changed from Ecovolt to KOSPI-listed flexible printed circuit board (FPCB) maker BH.
BH is reported to have expanded its stake through participation in a 2023 rights offering and CB acquisitions.
Alongside this governance shift, the company has reportedly purchased R&D center land in Osan, Gyeonggi Province, as part of a move into power semiconductors including power management ICs (PMIC), and is said to be exploring cooperation with BH Group affiliates.
In the back-end packaging industry, competition continues between large contract packaging firms and smaller SIP specialists, meaning the success of new business initiatives could be a key variable in the competitive landscape ahead.